Systems in Package(SiP) | ASIC and sub-system design | Multi-band Radios and Antennas | Communication Systems

ASIC and sub-system design

ASIC & FPGA design is done using traditional methods and mostly digital. The primary objective is to meet customers' integration, cost and time to market needs. SiP technology allows freedom from long drawn ASIC design cycles. Hence the combined methodology of ASIC design and using standard components through value added system engineering provides the most optimal solution.

For ASIC design, we follow the standard Cadence, Synopsys or Magma tool flow. For PCB design, SI/EM analysis, we use Cadence's Allegro and Sigrity's SpeedXP respectively. For Package layout, we use Sigrity's UPD and for RF design and SI/EM analysis, we use AWR and Sigrity's SpeedXP respectively. For thermal analysis, we have expertise in using Optimal, Icepack tool sets. Our hardware lab is equipped for advanced antenna and RF microsystem design.

Si2 has established sub-system design teams with over a decade of experience in Defense, Aerospace & Medical Electronics, who are well versed with the industry standard tools and related processes. The engineers have been exposed to solving Thermal, Cross Talk, Signal Integrity issues thereby rendering the design highly reliable.

Si2 Microsystems    85 Great Oaks Boulevard, San Jose, CA 95119  Tel: (408) 360-9100  Fax: (408) 360-9170  info-usa@si2micro.com
                                                   #84, EPIP, Whitefield Industrial Area, Bangalore 560 066 Tel:+91 80 67171100 Fax: +91 80 28413632  info-india@si2micro.com