Turnkey Systems (SMT) | IC / SiP Packaging | RoHS / MIL Standards | Global Infrastructure

IC / SiP Packaging

Success of SiP based products mainly depends on close coordination of design and production agencies, as the technology is highly dependent on the total compatibility of choice of materials, package architecture and IC assembly approaches.

The process parameters in the manufacturing line are evolved carefully through continuous line and process qualification procedures and these data form the strict guidelines at the design stage.

Located in a clean room facility of better than Class 5,000 and supported by inline and off line quality control instrumentation like SAM (Scanning Acoustic Microscope), SEM (Scanning Electron Microscope), low and high mag Visual Microscopes, X-ray microscopes with tilt facility, thermal mapping system, etc., the manufacturing line is sure to match the best in the industry in providing high yield and quality.

Being a vertically integrated setup, Si2 Microsystems enjoys constant feedback of process improvement into future designs and thus, Design for Manufacturability (DFM) is a built-in feature. Also, technology hand-in-hand with design is continuously evolving, paving the way for innovative SOLUTIONS being DELIVERED continuously.

Si2 Microsystems    85 Great Oaks Boulevard, San Jose, CA 95119  Tel: (408) 360-9100  Fax: (408) 360-9170  info-usa@si2micro.com
                                                   #84, EPIP, Whitefield Industrial Area, Bangalore 560 066 Tel:+91 80 67171100 Fax: +91 80 28413632  info-india@si2micro.com