Substrate Engineering | CSP & RF packaging
Substrate Engineering
SiP (System-in-a-Package) is sometimes used to describe certain multi-chip IC packages like stacked die packaging, Chip Scale Packaging (CSP), Multi-Chip Modules-BGA (MCM-BGA), etc. However, in addition to these innovative IC assembly approaches, the core enabler in SIP technology is appropriate Substrate Engineering, for a given system, to embed passives and passive-based networks like filters and matching circuits, thus providing a major gain in real estate. This approach provides unlimited benefits in RF applications wherein integration of multi-band antennae, MEMS based RF switches, variety of filters and filter components is possible. The limiting factor is the acceptable yield level and NRE cost of the custom realized substrate with embedded passives.
Si2 Microsystems, along with its in house expertise in substrate design approaches, has strategic alliance / tie up with leading substrate vendors covering the standard industry options of special ceramics, LTCC, Laminates, Quartz or Glass. Electrical and Thermal modeling of substrate and package designs at every stage only will ensure the successful final product meeting quality standards. Si2 Microsystems has access to leading CAD tools and has wide experience in modeling and optimization.
Low Temperature Co-fired Ceramic (LTCC) provides the best option in stability, tolerance and precision level in realizing passives, lower dielectric losses, cavities for bare die, etc. It is the ideal approach for mid to high range wireless RF applications, but is relatively more expensive and warrant higher turnaround. Laminate-based embedding of passives is a low cost large scale manufacturing approach with multiple metal layers and low ohmic losses due to copper routing. With limited stability, wide tolerance of values and lower temperature of operation, it is an ideal choice for cost sensitive consumer applications. Special materials like quartz, glass and high-end ceramics are available for special applications demanding extreme operating conditions like automotive and aerospace systems.
Given an application, Si2 Microsystems has the core expertise to arrive at the best solution, liaison with the qualified vendor towards delivering quality and cost effective substrate engineered products.
85 Great Oaks Boulevard, San Jose, CA 95119 Tel: (408) 360-9100 Fax: (408) 360-9170 info-usa@si2micro.com
#84, EPIP, Whitefield Industrial Area, Bangalore 560 066 Tel:+91 80 67171100 Fax: +91 80 28413632 info-india@si2micro.com