| We intend to fill positions for the following skill sets: |
| |
| 1) SiP design |
| 2) Package design |
| 3) Thermal / Mechanical design |
| 4) System Architecture for ASIC design |
| 5) Telco H/W engineer with IAD design experience |
| 6) S/W engineer with exposure to VOIP protocol; |
| 7) RF design; |
| 8) Antenna design |
| 9) Process engineering for CSP / Advanced Packaging |
| 10) HR Manager |
| 11) SIP Layout Design |
| 12) Signal Integrity- IC Packaging |
| 13) Testing-Telecom Hardware |
| 14) DFM/DFT-Telecom |
| 15) AWR Engineer |
| 16) Project Lead- ASIC Design |
| 17) Design Engineer- ASIC Design |
| 18) QA/QC Engineer |
| 19) TL Validation-IP(FPGA); |
| 20) PM with IAD Experience |